SURFACE MOUNT NOMENCLATURE AND PACKAGING

1 SURFACE MOUNTNOMENCLATUREAND PACKAGINGTel 800-776-9888 Email 4 MELF Tantalum .12 Transistors and 14 Lead 27 (Ball Grid Array)..36 Flip Pitch booklet is a plain-English introduction to SURFACE MOUNT nomenclatureand PACKAGING . Soon you will be speaking the language of SURFACE Mountjust like a NomenclatureThere are many different types of SURFACE MOUNT packages. Each time anew SURFACE MOUNT package is developed a new name is created. Thesenames are usually abbreviated by their initials. As an example: The QuadFlat Pack is commonly known as the QFP. Unfortunately, some packageshave more than one name. This sometimes creates confusion in theindustry. I will do my best to explain the subtle dif ferences betweencomponent Package versus PackagingLet's start by clarifying the difference between the words "package(s)" and" PACKAGING ." The word "package" is used in this book to refer to thecomponent's physical shape or outline.

2 The word " PACKAGING " is used inthis book to describe how the component is stored. As an example: Tapeand Reel is the PACKAGING . QFP is a TrendsSurface MOUNT technology changes rapidly . However , trends can beidentified. This book includes my observations of industry trends. Byunderstanding these trends, you will gain a fuller appreciation of thecomponents described in this book. They will begin to take on a life of theirown and will become more meaningful to you than just names on a CHIP NOMENCLATURELet's start out by studying simple flat chip components such as ceramiccapacitors and footprint (size) of flat chips is identified by a 4-digit size the USA, this 4-digit size code is measured in inches. Outside the USA,the size code may be either millimeters or inches. This can causeconfusion, so it is important to verify whether the size code is in metric first two digits in the size code refer to the length (L) from Termination-to-Termination.

3 The second two digits refer to the width (W) of example, if the first two digits in the size code are 12, then the length ofthe flat chip is .12". However, if the size code is metric, the 12 would thickness (T) of the package is not included in the 4-digit size code. Youmust refer to the actual manufacturer's data sheet to get informationregarding are the most common size codes for capacitors and resistors:Size CodeApproximate Size (LxW)InchMetricInchMetric04021005*.04" x .02" x *.05" x .04" x " x .03" x " x .05" x * " x .05" x " x .06" x * " x .10" x " x .12" x " x .25" x * Caution: Overlapping size codes. Metric appears same as ON NEXT PAGE5 FLAT CHIPS Capacitors & Resistors DimensionsUSA = InchesOutside USA = Metric or Inches*Thickness is not included in the 4-digit size 10 Caution: Must verify if size code is metric or :LengthWidthWL* " or " or ON NEXT PAGE6At the present time, component handling equipment capable of handling0402 size components is not widely available.

4 However, new equipmentcapable of handling small sized components is rapidly being sized components are also more difficult to solder and service in fact, the 0402 is so small, it looks just like a grain of black pepper foundin your is leading the way towards miniaturization. It is still common forAmerican firms to use 1206 and 0805 resistors, while most Japanesecompanies use only 0805 and 0603 sizes. Americans are slowly incorpo-rating 0603 resistors and capacitors into their new is in the prototype stage in Japan, the USA and CHIP TRENDSCONTINUED ON NEXT PAGE7 PrototypeFLAT CHIPSTRENDS Chips Are Getting Smaller Japan Leading the WayToward Miniaturization Component Handling InfrastructureNot Yet Widely Available for 0402 SizeDesign InNow0603080504021206080506030402 USAJ apanPrototypeNowCONTINUED ON NEXT PAGE87 inch (178mm) diameter reels are standard around the world for capacitorsand resistors. These reels can hold 5,000 resistors and typically 3,000 to4,000 inch (330mm) reels are available on special order for higher volumeusers.

5 The large reel holds more components (example: 10,000 parts) andrequires less handling than do 7 inch (178mm) (cardboard) reels with punched paper carrier tape are the mostpopular PACKAGING for reels with embossed plastic carrier tape are the most popularpackaging choice for ceramic multilayer , capacitors are available with paper tape and paper reels, andresistors are available with plastic tape and plastic low volume assembly, bulk PACKAGING in plastic (vinyl) bags is alternative type of PACKAGING is now being offered by Japanese chip shooters (plastic dispensing boxes) and casette holders offerseveral environmental advantages over tape and reel shooters consume less physical space and weigh less than tape andreel. Therefore, freight charges (and gas/petrol consumption) are paper tape and paper reels waste trees, refillable chip shootersconserve our forests and natural , plastic tape and plastic reels are not biodegradeable and this raisesfurther concern over environmental CHIP PACKAGINGCONTINUED ON NEXT PAGE9 PACKAGINGFLAT CHIPTape & Reel7" DIAMETER STANDARD13" SPECIAL ORDERC apacitorsResistors1st Choice Plastic1st Choice Paper2nd Choice Paper2nd Choice PlasticCARRIER TAPEREEL MATERIAL PLASTIC PAPER10 MELF components are more popular in Japan and Europe than in the stands for Metal Electrode Face Bonded and consists of twoterminals bonded into a cylindrical resistors and capacitors are less expensive than their flat chipcounterparts.

6 However, they require special handling during biggest disadvantage of MELF components is that they may tend to rolloff their solder pads during are also available in MELF and mini-melf COMPONENTSCONTINUED ON NEXT PAGE11 CYLINDRICALMELFCOMPONENTS Diodes Resistors Capacitors MELF Not Popular in USA Rolls on PC Board 0805 SOD 80 Mini-melf x mm 1406 2308 SM1 x years ago, the electronic industry adopted the (American)and (European) standard case sizes for molded tantalum Japanese EIAJ standard is not fully compatible with American andEuropean and have established four standard case sizes. Thesecase sizes are designated with the letters A, B, C, D or by their 4-digit metricsize code. Package height is not included in the size CodeCodeMetric X x x x most common PACKAGING for molded tantalum capacitors is plastic tapeand either plastic or cardboard TANTALUM CAPACITORSCONTINUED ON NEXT PAGE13 MOLDED SizesA, B, C, mm1632 Footprint is Metric A case =14 Rectangular transistors and diodes are SOT packages (Small OutlineTransistor).

7 The most popular size is the SOT23. Other packages include the SOT89,SOT143 and Japanese have designated the SC59 which is almost the same size asthe addition, the Japanese have developed the Mini-SOT which is approxi-mately one-half the size of a standard developed the DP AK and D2 P AK to house higher-powereddevices. The D2 PAK was designed to replace the popular TO220 for rectangular diodes and transistors are getting both smallerand smallest rectangular transistor is now the mini-SOT, and it is gainingpopularity in biggest SURFACE MOUNT transistor is the D2 PAK which was developedby Motorola to offer a direct footprint equivalent to the popular throughholeTO220 packages are designed to accommodate high power silicon AND DIODESCONTINUED ON NEXT PAGE15 SOT FEATURES Rectangular Easy Placement Old Technology SOT 23, SOT 89 SOT 143, SOT 223 DPAK FEATURES Replaces TO220 High Power Tape & ReelSOTTRANSISTORSAndDIODESDPAKSOT 23 Most PopularMini SOTCONTINUED ON NEXT PAGE16 Tape and reel is the most popular PACKAGING for SMD transistors anddiodes.

8 Smaller SOT packages are mounted on 7 inch (178mm) packages such as DPAK and D2 PAK are normally sold on 13 inch(330mm) must be taken in ordering SOT23 with the correct are two choices: T1 and T2. The T1 orientation is the most popularand has one lead of the SOT23 facing the sprocket holes on the carrier T2 is oriented on the tape with two leads facing the sprocket AND DIODE PACKAGINGT ypical Quantity on ReelPackage QtySOT233,000 SOT 891,000 SOT 1432,000 SOT 2231,000 DPAK2,500 SOD802,500SM1 MELF1,500 Always plasticcarrier tapeCONTINUED ON NEXT PAGE17 CARRIER TAPE Always PlasticORIENT ATION T1 SOT23 1 Lead Toward Sprocket Holes(Most Preferred) T2 SOT23 2 Leads Toward Sprocket HolesTRANSISTOR & DIODEPACKAGING Most Popular T&R SOT = 7" Reel DPAK= 13" Reel18 Package types for SURFACE MOUNT integrated circuits can be grouped flat pack is old QUAD flat pack and TSOP use newer family has certain characteristics in common such as lead style, leadpitch, body size and case remainder of this book is devoted to describing SMD integrated INTEGRATED CIRCUITS FAMILYCONTINUED ON NEXT PAGE19 LEADED CHIPCARRIERFLAT PACKQUAD FLAT PACKSMALLOUTLINETSOPPIN GRID ARRAYOVERVIEWSMDIC FAMILY20 LEAD STYLESLet's start by learning the three basic lead styles.

9 Each lead has a namewhich resembles its leads are small and quite fragile. They can easily be damagedand must be handled with great leads are used to get the highest number of leads onto an IC. Itis possible to get 40 to 80 leads per linear inch (15 to 33 leads per cm) ontoan IC using gull-wing leads. Gull-wing leads are easy to inspect are more sturdy than gull-wing leads; however, they take up morespace. With J-leads, you can only get 20 leads per linear inch (8 leads percm) on an IC leads are also used on IC's. Flat leads must be stored in special carriersto prevent lead prior to use, IC's with flat leads are cut and bent into gull-wings by usinglead forming equipment. Lead forming equipment is an extra , flat leads are the least popular type of IC words lead pitch are synonymous with lead ON NEXT PAGE21 SMDLEADSSTYLES J-LEAD GULL-WING FLAT22 SOLSOLICVSOPSOPTSOP?Small Outline IC's belong to a family of packages with a variety of leadstyles and lead counts.

10 Small outline packages are called by over 10different names. There are small differences between each type, and oftenthey are called by the wrong name. On pages 22 - 23, we will discuss SMALL OUTLINE NOMENCLATURESOSSOPSOJSOLJSOMCONTINUED ON NEXT PAGE23 SOIC TRENDSThe trend toward higher density (more leads) new VSOP, QSOP and SSOP doubles the number of leads whilemaintaining the traditional small outline appearance. This is accomplishedby decreasing the lead pitch from 50 mils ( ) down to 25 mils (.636mm).Also, there is a trend to package larger silicon die into wider body SOIC' is accomplished by expanding the package width from 300 mils( ) to 330 mils ( ), 350 mils ( ), 400 mils (10mm) andeven 440 mils ( ).The TSOP package combines a low profile case with high density lead pitchof mils (.5mm). The future looks bright for TSOP traditional 150 mil ( ) SO package and 300 mil ( ) SOLpackage are now commonplace in the ON NEXT PAGE24SO Small Outline is the original design.