TECHNICAL BULLETIN - Amphenol Aerospace

1 TECHNICAL BULLETIN GENERAL PRODUCT specification FOR VIPER BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM TB-2094 Revision A 8/11/09 Page 1 of 14 REVISION STATUS Revision SCR No. Description Initial Date A 55059 DRAFT Colleen Murphy 8/11/09 Copyright @ 2009 by Amphenol Backplane Systems. The material contained in this document is confidential and proprietary to Amphenol Backplane Systems. It is intended for internal use only and may not be disclosed to third parties, reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, or recording without the prior written permission of Amphenol Backplane Systems. TECHNICAL BULLETIN GENERAL PRODUCT specification FOR VIPER BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM TB-2094 Revision A 8/11/09 Page 2 of 14 SCOPE Content This specification covers the performance, test and quality requirements for the VIPER x backplane interconnect system and the x mating daughtercard connector.

2 These connectors are two-piece devices that connect two printed circuit boards. Daughtercard blade wafers and backplane receptacle connectors are through-hole-devices with eye-of-the-needle compliant pin contacts. The VIPER connector family consists of the following modular configurations with custom power and guidance modules. Standard 3U and 6U configurations per VPX standard (VITA 46) Custom Guidance Module Custom Power Module Custom RF Module Custom Optical Module Qualification When tests are performed on subject product line, procedures specified in Section 13 of this document shall be used per the test sequences outlined in Figure 1. All inspections shall be performed using applicable inspection plan and product drawings. REFERENCE DOCUMENTS The following documents form a part of this specification to the extent specified herein.

3 Amphenol Backplane Systems Documents TB-2095 VIPER Connector Qualification Plan Summary TB-2096 VIPER Signal Integrity Characterization Report TB-2097 VIPER Signal Trace Routing Guidelines Backpanel and Daughtercard TB-2098 VIPER Connector Application Guidelines TB-2099 VIPER Connector Repair Procedures Commercial and Military Standards MIL-STD-1344A Test Methods for Electrical Connectors EIA-364 D Electrical Connector Test Procedure Including Environmental Classifications IEC 60512-3 Connectors for Electronic Equipment, Tests and Measurements Part 3-1: Insulation Tests MIL-STD-810 Environmental Engineering Considerations and Laboratory Tests EN 61000-4-2 Electromagnetic Compatibility (EMC) Part 4-2: Testing and Measurement Techniques Electrostatic Discharge Immunity Test MIL-M-28787 General specification for Modules, Standard Electronic GR-1217-CORE Generic Requirements for Separable Electrical Connectors Used in Telecommunications Hardware TECHNICAL BULLETIN GENERAL PRODUCT specification FOR VIPER BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM TB-2094 Revision A 8/11/09 Page 3 of 14 MATERIALS AND FINISHES Contacts Backplane signal forks shall be thick, C7025 copper alloy.

4 Finish shall be thick nickel minimum all over per SAE-AMS-QQ-N-290, Class I. Selective minimum thick gold per ASTM B488, Type II, Grade C, Class in the mating area. minimum 60-40 Reflowed Tin/Lead (thickness measured prior to reflow) selectively plated in the compliant pin area. Backplane ground forks shall be thick, C7025 copper alloy. Finish shall be thick nickel minimum all over per SAE-AMS-QQ-N-290, Class I. Selective minimum thick gold per ASTM B488, Type II, Grade C, Class in the mating area. minimum 60-40 Reflowed Tin/Lead (thickness measured prior to reflow) selectively plated in the compliant pin area. Daughtercard signal and ground wafer leadframes shall be thick, C7025 copper alloy. Finish shall be thick nickel minimum all over per SAE-AMS-QQ-N-290, Class I.

5 Selective minimum thick gold per ASTM-B488, Type II, Grade C, Class in the mating area. minimum 60-40 Reflowed Tin/Lead thickness measured prior to reflow) selectively plated in the compliant pin area. Daughtercard power wafer leadframe shall be thick, C7025 copper alloy. Finish shall be thick nickel minimum all over per SAE-AMS-QQ-N-290, Class I. Selective minimum thick gold per ASTM B488, Type II, Grade C, Class in the mating area. minimum 60- 40 Reflowed Tin/Lead (thickness measured prior to reflow) selectively plated in the compliant pin area. Backplane Insulators and Wafer Insert Molding Material Glass reinforced polyester (Liquid Crystal Polymer), UL 94V0, Color Black. Front and Rear Stiffeners Stainless Steel, thick, Type 301, Hard, Finish per Mill 2B.

6 Guide Pin Material Stainless Steel, Type 303, Passivated. Guide Blocks Stainless Steel, Type 440, Passivated. TECHNICAL BULLETIN GENERAL PRODUCT specification FOR VIPER BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM TB-2094 Revision A 8/11/09 Page 4 of 14 MATED BULK RESISTANCE Wafer Type Electrical Length Bulk Resistance Differential A (Odd) (mm) (milliohms) A B E F I C, D, G and H Ground Differential B (Even) C D G H A, B, E, F and I Ground Single Ended B C E G H A, D, F and I Ground Power A B C D F G H I Notes: 1. The resistance values are typical measured values. 2. Electrical Lengths are measured from DC wafer compliant pin to Backplane contact compliant pin in the mated condition.

7 TECHNICAL BULLETIN GENERAL PRODUCT specification FOR VIPER BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM TB-2094 Revision A 8/11/09 Page 5 of 14 POWER RATINGS For 10 C Rise: Amps per via or 5 Amps for 1 power plane within the power wafer or 10 Amps total for both power planes (6 vias total). For 30 C Rise: Amps per via or Amps for 1 power plane within the power wafer or 16 Amps total for both power planes (6 vias total) NOTE: Calculations based on a via in a double sided board with a drill ( finished hole). Internal layers carrying the same current would increase the current carrying capacity of the wafer. CURRENT AND TEMPERATURE RATINGS Description Value Signal Contact 1 Amp Per Contact Ground Contact 1 Amp Per Contact Power Contact Per Section Mating Interface Contact Resistance Change 10 Milliohms Maximum Compliant Pin to Plated Thru Hole Resistance 1 Milliohm Maximum Dielectric Withstanding Voltage 500 Volts RMS Insulation Resistance 1,000 Megohms Maximum Operating Temperature 125 C MECHANICAL RATINGS Value Per Contact Description Grams Newtons Signal and Ground Contact Normal Force 85 Signal and Ground Contact Engagement Force 35 40.

8 35 - .40 Signal and Ground Contact Separation Force 25 30 .25 - .30 Signal, Shield and Power Contact Durability 250 Mating Cycles minimum. 500 Mating Cycles maximum Contact Minimum Wipe Values Signal and Power: , Ground: Values listed are nominal Weight Mated Pair 3U grams 6U grams Module 3U grams 6U grams Back plane 3U grams 6U grams TECHNICAL BULLETIN GENERAL PRODUCT specification FOR VIPER BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM TB-2094 Revision A 8/11/09 Page 6 of 14 COMPLIANT PIN INTERFACE Description Value per Pin Signal and Ground Compliant Pin Insertion Force (BP) 4 11 lbs Signal and Ground Compliant Pin Retention Force (BP)

9 5 Lbs minimum Daughtercard Wafer Compliant Pin Insertion Force 4 8 lbs Daughtercard Wafer Compliant Pin Retention Force lbs minimum Hole Wall Deformation - Radial1 Per Side Hole Wall Deformation - Axial2 Notes: 1. Radial hole deformation not to exceed ( ) measured from drilled hole. 2. Axial hole deformation not to exceed ( ) measured in the vertical plane. PRINTED CIRCUIT BOARDS Minimum Backplane and Daughtercard thickness: Recommend ( ) Daughtercard Pattern Primary Drilled Hole Size: ( ) Daughtercard Pattern Finished Hole Size: ( ) Backplane Pattern Primary Drilled Hole Size: ( ) Backplane Pattern Finished Hole Size: ( ) DESIGN VERIFICATION AND QUALIFICATION TESTING Sample Selection: Refer to Section 14 for minimum recommended connector sample size.

10 Test Sequence: Qualification testing shall be performed per the sequences listed in Section 14 of this document. REQUALIFICATION TESTING If changes affecting form, fit or function are made to the product or to the manufacturing process, Engineering shall coordinate requalification testing of all or part of the original testing sequences as required. ACCEPTANCE Acceptance is based on verification that the product meets the requirements of Section 13. Failures attributed to equipment, test set-up, or operator deficiencies shall not disqualify the product. If product failure occurs, corrective action shall be taken and samples resubmitted for qualification. Verification of corrective action is required before resubmittal. TECHNICAL BULLETIN GENERAL PRODUCT specification FOR VIPER BACKPLANE AND DAUGHTERCARD INTERCONNECT SYSTEM TB-2094 Revision A 8/11/09 Page 7 of 14 specification SUMMARY Material Parameter specification Viper Value Reference Document Plating Integrity Acceptable Porosity 3 Pores per cm2 on all mating surfaces EIA-364-TP53 Exposed to nitric vapors Contact Metallization 50 microinches of Gold Minimum 50 microinches of Gold Minimum EIA-364-TP09 Durability 200 250 EIA-364-TP09 Base Surface finish is 16 RMS or otherwise specified 16 RMS on mating surfaces GR-1217-CORE Lubrication Must be present on all mating signal and ground blades Lubrication is not applied to the mating blades GR-1217-CORE Flammability Rating 94V-0 Must Pass Requirement UL94 Mechanical Parameter