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1 HITACHICOPPER CLADLAMINATESCOPPER CLAD LAMINATES2017In the world of electronics, especially information systems and equipment, advancements are occurring on a daily basis and many new technologies are rebuting one after the Chemical Co., Ltd. is engaged in producing materials from printed wiring boards to substrates and in processing materials using "combined technology," a combination of our existing reliable technologies developed over years and of leading-edge balanced, reliable, advanced solutions of hitachi Chemical and related peripheral technologies are designed to support the electronics of the solution you need is hereIn the world of electronics, especially information systems and equipment, advancements are occurring on a daily basis and many new technologies are rebuting one after the Chemical Co.

2 , Ltd. is engaged in producing materials from printed wiring boards to substrates and in processing materials using "combined technology," a combination of our existing reliable technologies developed over years and of leading-edge balanced, reliable, advanced solutions of hitachi Chemical and related peripheral technologies are designed to support the electronics of the solution you need is Recommended Base Materials by Application Characteristics Glass Epoxy Multilayer MaterialsMCL-HS100 MCL-E-770 GMCL-E-705 GMCL-E-700 GMCL-E-679 FGMCL-E-679F Type R MCL-E-78 GTD-002 MCL-E-75 GMCL-E-67 Materials for ICT InfrastructureMCL-E-679 Type W MCL-LW-900G/910 GMCL-HE-679G Type S Polyimide Multilayer MaterialMCL-I-671 Glass Epoxy Double Sided MaterialsMCL-E-67 CEM-3 E-668T Type K Tracking resistance Materials for Fine Patterning PF-EL Epoxy Adhesive FilmAS-2600 KOBELITE LAMINATEKEL-GEF Type R KEL-571 Only non-woven aramid structure KEL-973 Composite structure of non-woven aramid and polyester Precautionary

3 StatementPrecautions for UsePrecautions in ProcessPrecautions in DesigningPrecautions for Use of Completed PWBR ecommendation Press Condition for Multilayer BoardLamination StandardsUL StandardBS Standard CSA StandardP4P6P9P10P12P14P16P18P20P22P24P2 6P28P31P32P34P36P39P40P43P44P47P48P51P52 P55P56P57P60P62P62P65P66P67P68P69P70P83P 84P85 FeatureProductHalogen FreeGame InstrumentPersonal ComputerMobile PhoneRouter ServerBase StationAntennaMemory ModulesITSUL ANSIPageEnvironmentally Friendly Consumer products Infrastructure ProductsElectronics Devices ProductsAutomotive ProductsLead Free Application(288 C) SemiconductorTesting DevicesHigh-frequencyPartsElectronicCont rol Unit AutomotiveElectronicsPackage ForSemiconductor(BGA CSP MCM)Digital ConsumerProductsRecommended Base Materials by ApplicationFeatureProductHalogen FreeGame InstrumentPersonal ComputerMobile PhoneRouter ServerBase StationAntennaMemory ModulesITSUL ANSIPageEnvironmentally Friendly Consumer products Infrastructure ProductsElectronics Devices ProductsAutomotive ProductsLead Free Application(288 C) SemiconductorTesting DevicesHigh-frequencyPartsElectronicCont rol Unit AutomotiveElectronicsPackage ForSemiconductor(BGA CSP MCM)

4 Digital ConsumerProducts 10 12 14 16 GPY40 34 24 MultiLayer MaterialsMaterials ForICTI nfrastructureGlass Epoxy Double SideMaterialsMCL-E-67 GoodDimensional Reliability, and Dielectric PropertyLow Elastic ModulusMCL-E-679 Type(W)High Tg, Highinsulating ReliabilityMCL-E-679F Type(R)High Tg, High Elasticity, Low Thermal ExpansionMCL-E-679 FGHigh Tg, High Elasticity, Low Thermal ExpansionMCL-LW-900 GMCL-LW-910 GHigh Tg High Heat Resistance, Low Dielectric Constant,LowDissipationFactor 52 Materialsfor FinePatterningPF-ELSemi- additiveProcessCompatiblePolyimideMultil ayerMaterialsMCL-I-671 High Tg, High Heat ResistanceMCL-E-67 Dimensional Stability, Low Warpage CEM-348 CEM-3E-668 TType K High CTICEM-3 Low Dielectric Constant, High ElasticityMCL-E-705 GMCL-HS100 High Tg, High Elasticity, Low Thermal ExpansionHigh Tg, Low Dielectric Constant, Low DissipationFactor, Low Thermal ExpansionMCL-E-770 GHigh Tg, High Elasticity, Low Thermal ExpansionMCL-E-700 GHigh Tg, High Elasticity, Low Thermal ExpansionHigh Heat Resistance.

5 Low Dielectric Constant MCL-HE-679 GType S High Tg, HighHeatResistanceMCL-E-75 GMCL-E-78 GTD-0024 FeatureProductHalogen FreeGame InstrumentPersonal ComputerMobile PhoneRouter ServerBase StationAntennaMemory ModulesITSUL ANSIPageEnvironmentally Friendly Consumer products Infrastructure ProductsElectronics Devices ProductsAutomotive ProductsLead Free Application(288 C) SemiconductorTesting DevicesHigh-frequencyPartsElectronicCont rol Unit AutomotiveElectronicsPackage ForSemiconductor(BGA CSP MCM)Digital ConsumerProductsRecommended Base Materials by ApplicationFeatureProductHalogen FreeGame InstrumentPersonal ComputerMobile PhoneRouter ServerBase StationAntennaMemory ModulesITSUL ANSIPageEnvironmentally Friendly Consumer products Infrastructure ProductsElectronics Devices ProductsAutomotive ProductsLead Free Application(288 C) SemiconductorTesting DevicesHigh-frequencyPartsElectronicCont rol Unit AutomotiveElectronicsPackage ForSemiconductor(BGA CSP MCM)

6 Digital ConsumerProducts 10 12 14 16 GPY40 34 24 MultiLayer MaterialsMaterials ForICTI nfrastructureGlass Epoxy Double SideMaterialsMCL-E-67 GoodDimensional Reliability, and Dielectric PropertyLow Elastic ModulusMCL-E-679 Type(W)High Tg, Highinsulating ReliabilityMCL-E-679F Type(R)High Tg, High Elasticity, Low Thermal ExpansionMCL-E-679 FGHigh Tg, High Elasticity, Low Thermal ExpansionMCL-LW-900 GMCL-LW-910 GHigh Tg High Heat Resistance, Low Dielectric Constant,LowDissipationFactor 52 Materialsfor FinePatterningPF-ELSemi- additiveProcessCompatiblePolyimideMultil ayerMaterialsMCL-I-671 High Tg, High Heat ResistanceMCL-E-67 Dimensional Stability, Low Warpage CEM-348 CEM-3E-668 TType K High CTICEM-3 Low Dielectric Constant, High ElasticityMCL-E-705 GMCL-HS100 High Tg, High Elasticity, Low Thermal ExpansionHigh Tg, Low Dielectric Constant, Low DissipationFactor, Low Thermal ExpansionMCL-E-770 GHigh Tg, High Elasticity, Low Thermal ExpansionMCL-E-700 GHigh Tg, High Elasticity, Low Thermal ExpansionHigh Heat Resistance.

7 Low Dielectric Constant MCL-HE-679 GType S High Tg, HighHeatResistanceMCL-E-75 GMCL-E-78 GTD-0025 ItemConditionUnitUL ANSI Cppm/ mGPa c m W / m K TgCTE 1 Solder Heat Water AbsorptionTMA 30 120 C Tg Tg AAAAC-96/20/65C-96/20/65C-96/20/65C-96/2 0/65E-24/50 AXe-flashZ18 m35 m1 MHz1 GHz 21 MHz1 GHz 2 Copper Peel StrengthDielectric ConstantDissipation FactorVolume ResistivitySurface ResistanceInsulation ResistanceThermal ConductivityFlammability UL-94 Surface RoughnessFlexural Modulus (Lengthwise)C-96/20/65 XYGeneral Characteristics ItemConditionUnitUL ANSIM ultilayer MaterialsMaterials For ICT Infrastructure 1) Heating Rate: 10 C/min. 2) Measured by Triplate-line Resonator 3) 4) properties are typical figures as a figures as PCB may change depending on its material construction.

8 Above values are hitachi experimental data and not guaranteed. Cppm/ mGPa c m W / m K TgCTE 1 Solder Heat Water AbsorptionTMA 30 120 C Tg Tg AAAAC-96/20/65C-96/20/65C-96/20/65C-96/2 0/65E-24/50 AXe-flashZ18 m35 m1 MHz1 GHz 21 MHz1 GHz 2 +D-2/100 +D24/23 +D-2/100 +D24/23 Resistance(260 C)Copper Peel StrengthDielectric ConstantDissipation FactorVolume ResistivitySurface ResistanceInsulation ResistanceThermal ConductivityFlammability UL-94 Surface RoughnessFlexural Modulus (Lengthwise)C-96/20/65 XYDMADMA5 7295 3056 8240 260 MCL-E-705 GHalogen FreeMCL-HS100 Halogen Free 2 332 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 35 7250 27010 15>30070 2 323 28 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 46 84 6210 23020 30>300130 6320 340 MCL-E-770 GHalogen Free 330 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 4260 2808 13>30070 7 97 9250 270295 30515 25> 2 332 0V 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 390 120 MCL-E-700 GHalogen 96 9155 170 80 130> 135 8 1015 1 10161 1014 1 10151 1014 1 10161 1014 1 1513 15165 175200 22023 33> 323 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 3140 170 MCL-E-679 FGHalogen

9 1713 15160 170200 22035 45> 25 1014 1 10161 1013 1 10151 1014 1 10161 1013 1 R 1412 14160 170190 20020 30> 327 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 3130 W 1712 15173 183205 21550 60> 1324 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 FreeMCL-E-78 GHalogen Free14 1712 15155 170195 21530 25 0V 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 >300180 FreeMCL-LW-900 13013 1650 70200 300> 1323 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 0 MCL-E-67TD-00214 17150 EpoxyDouble Sided MaterialsMCL-I-671 GPY24 26V 012 1612 15200 213230 24550 80> 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 V 014 1713 16120 130 50 70> 1 1015 1 10161 1013 1 10151 1014 1 10161 1013 1 HVLP HVLP 16 21V 012 1512 15190 210240 28035 45> 1014 1 10161 1013 1 10151 1014 1 10161 1013 1 26V 014 1712 15180 190260 28030 40> 1014 1 10161 1013 1 10151 1014 1 10161 1013 1 S Halogen Free RT RT 6 ItemConditionUnitUL ANSI Cppm/ mGPa c m W / m K TgCTE 1 Solder Heat Water AbsorptionTMA 30 120 C Tg Tg AAAAC-96/20/65C-96/20/65C-96/20/65C-96/2 0/65E-24/50 AXe-flashZ18 m35 m1 MHz1 GHz 21 MHz1 GHz 2 Copper Peel StrengthDielectric ConstantDissipation FactorVolume ResistivitySurface ResistanceInsulation ResistanceThermal ConductivityFlammability UL-94 Surface RoughnessFlexural Modulus (Lengthwise)

10 C-96/20/65 XYGeneral Characteristics ItemConditionUnitUL ANSIM ultilayer MaterialsMaterials For ICT Infrastructure 1) Heating Rate: 10 C/min. 2) Measured by Triplate-line Resonator 3) 4) properties are typical figures as a figures as PCB may change depending on its material construction. Above values are hitachi experimental data and not guaranteed. Cppm/ mGPa c m W / m K TgCTE 1 Solder Heat Water AbsorptionTMA 30 120 C Tg Tg AAAAC-96/20/65C-96/20/65C-96/20/65C-96/2 0/65E-24/50 AXe-flashZ18 m35 m1 MHz1 GHz 21 MHz1 GHz 2 +D-2/100 +D24/23 +D-2/100 +D24/23 Resistance(260 C)Copper Peel StrengthDielectric ConstantDissipation FactorVolume ResistivitySurface ResistanceInsulation ResistanceThermal ConductivityFlammability UL-94 Surface RoughnessFlexural Modulus (Lengthwise)