Transcription of TO-247AC (High Voltage) - Vishay Intertechnology
1 Package Siliconix Revision: 08-Jan-20201 Document Number: 91360 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT (High Voltage) VERSION 1: FACILITY CODE = 9 Notes(1)Package reference: JEDEC TO247, variation AC(2)All dimensions are in mm(3)Slot required, notch may be rounded(4)Dimension D and E do not include mold flash. Mold flash shall not exceed mm per side. These dimensions are measured at the outermost extremes of the plastic body(5)Thermal pad contour optional with dimensions D1 and E1(6)Lead finish uncontrolled in L1(7) P to have a maximum draft angle of to the top of the part with a maximum hole diameter of mm(8)Dimension b2 and b4 does not include dambar protrusion.
2 Allowable dambar protrusion shall be mm total in excess of b2 and b4 dimension at maximum material , Siliconix Revision: 08-Jan-20202 Document Number: 91360 For technical questions, contact: DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT 2: FACILITY CODE = YNotes(1)Dimensioning and tolerancing per ASME (2)Contour of slot optional(3)Dimension D and E do not include mold flash. Mold flash shall not exceed mm ( ") per side. These dimensions are measured at the outermost extremes of the plastic body(4)Thermal pad contour optional with dimensions D1 and E1(5)Lead finish uncontrolled in L1(6) P to have a maximum draft angle of to the top of the part with a maximum hole diameter of mm ( ")(7)Outline conforms to JEDEC outline TO-247 with exception of dimension : E19-0614-Rev.
3 E, 08-Jan-2020 DWG: (2)(4) R/2B2 x RSDSee view B2 x e b43 x b2 x b2LC L1123 QDAA2 AAA1C kBDMMA P(Datum B) A - AThermal padD2 DDEECCView B(b1, b3, b5)Base metalc1(b, b2, b4)Section C - C, D - D, E - E(c)Planting4357444 Lead Assignments1. Gate2. Drain3. Source4. Drai
