Example: confidence
TSV Through Silicon Via Technology for 3D-integration
the devices by standard metallization (aluminium or copper, depending on the technology). (see fig.2 and 3) remain in the micron ran Fig.2: Memory stacks (Samsung) [15] Fig.3: Intel 300 mm multicore processors[15] TSVs can be categorized by when they are fabricated relative major classifications include the following: 1.
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