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Vol.84 No.5 2011 SiCパワーモジュールのパッケージ技術

Wide bandgap materials such as silicon carbide (SiC) and gallium nitride (GaN) are attracting attention as materials for next-generation power semiconductor devices. Fuji Electric is currently developing new packaging technologies to take full advantage of SiC devices.

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  Power, Nitride, Gallium nitride, Gallium

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Transcription of Vol.84 No.5 2011 SiCパワーモジュールのパッケージ技術

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