This document provides guidance for manufacturers and ...

Minimum fillet height on chip packages is the solder thickness under the package plus 25% of the height of the end termination or the solder thickness plus 0.5mm (0.02in) ... solder joints . X-ray inspection is required. ... Exposed glass fibers are allowed only on the board perimeter and around the diameter of unsupported holes a distance of 0 ...

  Board, Joint, Packages, Solder, Solder joint