ASSOCIATION CONNECTING ELECTRONICS …
IPC-7525AStencil design GuidelinesDeveloped by the stencil design Task Group (5-21e) of the Assemblyand Joining Processes Committee (5-20) of IPCUsers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1249Tel 847 847 :IPC-7525 - May 2000ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of and Definitions ........................................ . *Aperture ........................................ ..................... *Aspect Ratio ........................................ ............... *Area Ratio ........................................ .................. ........................................ ........................... Paste Transfer Head ........................... Factor ........................................ ................... ........................................ ....................... BGA/Chip Scale Package (CSP).
IPC-7525A Stencil Design Guidelines Developed by the Stencil Design Task Group (5-21e) of the Assembly and Joining Processes Committee (5-20) of IPC
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