Transcription of Micro Structure Observation and Reliability …
{{id}} {{{paragraph}}}
Example: confidence
Micro Structure Observation and Reliability …
73 Orii et al.: Micro Structure Obser vation and Reliability behavior (1/14)[Technical Paper] Micro Structure Obser vation and Reliability behavior of Peripheral flip chip Interconnections with Solder-Capped Cu Pillar BumpsYasumitsu Orii*, Kazushige Toriyama*, Sayuri Kohara*, Hirokazu Noma*, Keishi Okamoto*, Daisuke Toyoshima**, and Keisuke Uenishi**IBM Research Tokyo, 1623-14, Shimotsuruma, Yamato-city, Kanagawa-ken 242-8502, Japan**Osaka University, 2-1, Yamadaoka, Suita, Osaka 565-0871, Japan(Received September 1, 2011; accepted November 10, 2011)AbstractPoP (Package on Package) structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones.
75 Orii et al.: Micro Structure Observation and Reliability Behavior (3/14) chip die and SMT component joints are formed in a single reflow step. After a flip chip …
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
Design for Flip-Chip and Chip-Size Package, Design for Flip-Chip and Chip-Size Package Technology, And Application of Underfill Material for Flip Chip, For Flip Chip, NanoStar & NanoFree, Chip, Package, Size, Flip Chip Package, Compatibility, For Flip, Chip Thin Film Resistors, Stencil Design Guidelines, Design