Transcription of High Performance 3D Package for Wide IO Memory
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High Performance 3D Package for Wide IO Memory
43 Mohammed et al.: High Performance 3D Package for Wide IO Memor y (1/8)1. IntroductionMobile computing has evolved beyond PC computing capabilities and can carr y out tasks ranging from office productivity and communication to HD media and gaming. There are three broad trends in computing over the past few years that have a significant impact on the processor-memor y architecture and its implementation. They are: 1) The transition from single core to multi-core CPUs, which dramatically increased the need for multiple memor y channels, the channel bandwidth and the amount of mem-or y that is accessible to each core; 2) Low power comput-ing that emphasizes physically short interconnects along with a wide bus at lower speeds for high bandwidth, and 3) Cloud computing, which benefits from having both hard-ware and software optimized and centrally managed for power and most critical feature to keep increasing the perfor-mance is the processor-memor y interconnect.
45 Mohammed et al.: High Performance 3D Package for Wide IO Memory (3/8) Figure 8 shows that BVA offers the smallest pitch and highest IO compared to BGA (Ball Grid Array) PoP and Through Mold Via (TMV) PoP.
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