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Micro Structure Observation and Reliability …
73 Orii et al.: Micro Structure Obser vation and Reliability behavior (1/14)[Technical Paper] Micro Structure Obser vation and Reliability behavior of Peripheral Flip Chip Interconnections with solder -Capped Cu Pillar BumpsYasumitsu Orii*, Kazushige Toriyama*, Sayuri Kohara*, Hirokazu Noma*, Keishi Okamoto*, Daisuke Toyoshima**, and Keisuke Uenishi**IBM Research Tokyo, 1623-14, Shimotsuruma, Yamato-city, Kanagawa-ken 242-8502, Japan**Osaka University, 2-1, Yamadaoka, Suita, Osaka 565-0871, Japan(Received September 1, 2011; accepted November 10, 2011)AbstractPoP (Package on Package) structures have been used widely in digital consumer electronics products such as digital still cameras and mobile phones.
73 Orii et al.: Micro Structure Observation and Reliability Behavior (1/14) [Technical Paper] Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps
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