Chapter A: Wire Bonding 2 Level 2. Conclusions …
Chapter A: Wire Bonding 2 Level 2. Conclusions and guideline Wirebonding techniques There are two basic wirebonding techniques that are used in thermocompression (T/C), thermosonic (T/S). or ultrasonic (U/S) Bonding process: ball Bonding and wedge Bonding . Approximately 93% of all semiconductor packages are manufactured using ball Bonding method, while wedge Bonding is used to produce about 5% of all assembled packages. Ball Bonding In this technique, wire is passed through a hollow capillary, and an electronic-flame-off system (EFO) is used to melt a small portion of the wire extending beneath the capillary. The surface tension of the molten metal from a spherical shape, or ball, as the wire material solidifies.
Chapter A: Wire Bonding 2 Level 2. Conclusions and guideline 2.1 Wirebonding techniques There are two basic wirebonding techniques that are used in thermocompression (T/C), thermosonic (T/S)
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