Review of the Impact of Intermetallic Layers on the ...

6-03-15 IVF Project Report 06/07 Review of the Impact of Intermetallic Layers on the brittleness of Tin-Lead and Lead-Free solder Joints Per-Erik Tegehall, IVF Project Report 06/07 D:\PET\ PER-ERIK TEGEHALL, 10 MARCH 2005 Preface This Review has been funded by Vinnova (Swedish Governmental Agency for Innovation Systems) and Swerea. It is a part of the work done in ELFNET Sweden to assess how the transition to lead-free soldering will affect the risk for brittle fractures in solder joints. M lndal, March 2006 Per-Erik Tegehall E-mail: IVF Argongatan 30 SE-431 53 M lndal SWEDEN Telephone +46-31-706 60 00 Facsimile +46-31-27 61 30 IVF Industrial Research and Development Corporation, 2006 IVF Project Report 06/07 D:\PET\ PER-ERIK TEGEHALL, 10 MARCH 2006 Contents Summary 4 1 Introduction 7 2 Growth of Intermetallic Compounds in solder Joints 9 Intermetallic Compounds Formed with Tin-Lead Solders 9 Copper Surfaces 9 Nickel Surfaces 11 Palladium Surfaces 16 Intermetallic Compounds Formed with Lead-Free Solders Based on Tin, Silver and Copper 17

6-03-15 IVF Project Report 06/07 Review of the Impact of Intermetallic Layers on the Brittleness of Tin-Lead and Lead-Free Solder Joints Per-Erik Tegehall, Ph.D.

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  Impact, Early, Solder, The impact of intermetallic layers, Intermetallic, The impact of intermetallic layers on the brittleness, Brittleness

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