Transcription of 100% Pure Tin Plating Process - Natronix
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7 Tin Plating Sep 2, 2013 Page 1 of 4 100% pure Tin Plating Process Need for the Process : The demand from the semiconductor industry for Green-IC packaging is gaining momentum. In Japan the Japanese Electronic Industry Association (JEIDA), has been formed to monitor its Green progress, and in Europe the European Waste in Electrical and Electronic Equipment (WEEE) taskforce is directed to minimize the environmental impact of electronic waste.
7 Tin Plating Sep 2, 2013 Page 3 of 4 Alternative lead-free lead finish materials Alternative "lead-free" lead finish materials for use in the solder plating shall have a stringent visual,
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SOLDER PRODUCTS, Solder, Soldering, Technical Data Sheet, Lead-Free Solder Bump Technologies for Flip-Chip, Lead-Free Solder Bump Technologies for Flip-Chip Packaging, DUPONT, MATERIALS, Silver, How to manage wave solder alloy, The Impact of Intermetallic Layers, The Impact of Intermetallic Layers on the Brittleness, Why Lead-free