Transcription of How to manage wave solder alloy contamination - …
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How to manage wave solder alloy contaminationsGerjan Diepstraten & Harry TripCobar Europe BVBalver ZinnContent SnPb solder and impurities Lead-free solder change Pb contaminations in lead-free Measure solder composition Sample interval Recommendations Wave soldering versus selectiveSnPb impuritiesLimits according to IPC-J-STD001 EScores from >1500 solder pot analysisOut of specification:Copper contamination in SnPbMaximum 0,3%Remove at 190 C with stainless steel strainerExchange solderProcedure:1. Empty solder pot2. Clean all parts3. Refill pot with pure Sn (wash Sn)4. Run solder pumps for > 0,5 hour4. Empty solder pot5. Refill solder pot with lead-free solderSolder exchange Sn washPercentage of Pb after lead-free refillUse wash Sn to get low Pb impuritiesSpectro analysis1.
How to manage wave solder alloy contaminations Gerjan Diepstraten & Harry Trip Cobar Europe BV Balver Zinn
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SOLDER PRODUCTS, Solder, Soldering, Technical Data Sheet, Lead-Free Solder Bump Technologies for Flip-Chip, Lead-Free Solder Bump Technologies for Flip-Chip Packaging, DUPONT, MATERIALS, Silver, The Impact of Intermetallic Layers, The Impact of Intermetallic Layers on the Brittleness, 100% Pure Tin Plating Process, Why Lead-free