Transcription of Lead-Free Solder Bump Technologies for Flip-Chip …
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Lead-Free Solder Bump Technologies for Flip-Chip …
Lead-Free Solder Bump Technologies for Flip-Chip packaging Applications Zaheed S. Karim1 and Jim Martin2 1 Advanced Interconnect Technology Ltd. 1901 Sunley Centre, 9 Wing Yin Street, Tsuen Wan, Hong Kong Tel: (852) 2719-5440, Fax: (852) 2358-4766, E-mail: 2 Shipley LLC 455 Forest Street, Marlborough, MA 01752, USA Tel: (516) 868-8800, Fax: (516) 868-4781, E-mail: Abstract We describe the fabrication and characterization of five different types of Lead-Free Solder bump interconnections for use in Flip-Chip electronic packaging applications. Lead-Free Solder bumps were fabricated from pure-tin (Sn), tin-bismuth (Sn:Bi), eutectic tin-copper (Sn:Cu), eutectic tin-silver (Sn:Ag), and ternary tin-silver-copper (Sn:Ag:Cu) alloys.
Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim1 and Jim Martin2 1Advanced Interconnect Technology Ltd. 1901 Sunley Centre, 9 Wing Yin Street, Tsuen Wan, Hong Kong
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