DEK Semiconductor Packaging Technologies

← Back to document page

ProFlow developed froma concept by Know the +1 847 368 1155ASIAChina: +86 755 2759 9188Singapore: +65 6484 7010Distributor InformationEUROPEUK: +44 1305 760760 Germany: +49 6101 5227-0 Hungary: +36 96 512 Know the DifferenceDEK Semiconductor Packaging Technologies0302Lowering the Cost of Advanced Packaging Achieving the most direct connection to silicon miniaturising package dimensions and maximising ICperformance defines the leading edge of chip-scale package design. Assembling chip-scale packages demands accurate and precise back-endprocesses for depositing materials such as solder paste, solder spheres, flux,and adhesives. Precision printing is known to deliver the high levels of control,repeatability and productivity necessary to build today s most advancedpackages and to solve the next challenges now visible on the , as package outlines and interconnect dimensions continue to shrink,the boundaries between back-end package processes and board-level assemblyusing the most advanced surface-mount packages are progressively blurring.

DEK Semiconductor Packaging Technologies. 02 03 Lowering the Cost of ... packages – and to solve the next challenges now visible on the technology horizon. Moreover, as package outlines and interconnect dimensions continue to shrink, ... packaging and assembly markets.

  Technology, Packaging, Assembly, Semiconductors, Semiconductor packaging