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3D IC INTEGRATION TECHNOLOGY …
3D IC INTEGRATION TECHNOLOGY development IN CHINA Wei Koh, Pacrim TECHNOLOGY Irvine, CA, USA ABSTRACT China s semiconductor foundry and microelectronic packaging industries are embracing the move to join 3D IC INTEGRATION TECHNOLOGY development with ample funding and rapid pace. An overview of the recent progress on the efforts in 3D IC INTEGRATION TECHNOLOGY development by the leading domestic companies and research institutes is provided here. Because China still lacks in infrastructure for advanced and modern front end of the line (FEOL), backend of the line (BEOL), and middle-end of the line (MEOL) process capabilities for 300mm wafers, development efforts on 3D IC INTEGRATION have many limitations to begin with.
efforts in 3D IC integration technology development by the ... semiconductor and back-end packaging assembly industry; how the industry’s growth had been planned and cultivated to arrive at the present condition. Having established such ... 3D IC INTEGRATION TECHNOLOGY DEVELOPMENT IN CHINA ...
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