Transcription of Trends, Transitions, and Inflection Points in ...
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IEEE Electronics packaging Society (EPS), Santa Clara Valley ChapterFebruary 14, "Trends, Transitions, and Inflection Points in Semiconductor packaging "F b14 2018 February 14, 2018 Dan Tracy, Sr. DirectorSEMI Industry Research & StatisticsOutline Quick 2017 Overview Semiconductor Industry Outlook and Market DriversSemiconductor Industry Outlook and Market Drivers packaging Market Trends Business and technology Material Segments China SummaryIEEE Electronics packaging Society (EPS), Santa Clara Valley ChapterFebruary 14, Overview2017-A Record Setting Year 2017 is a record setting year for the industry Semiconductor sales.
Semiconductor Packaging" F b 14 2018February 14, 2018 Dan Tracy, Sr. Director SEMI Industry Research & Statistics ... packaging and assembly at the wafer level ... • WB to FC • FO-WLP is a disruptive technology
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