dvanced Packaging Technologies for Miniaturized Modules

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dvanced Packaging Technologies for MiniaturizedModulesVinayak PandeyVP, Product Technology Marketing, STATS ChipPACForm FactorPerformanceIntegrationLow CostAnalog Package RequirementsAnalog Package TrendsfcQFN FCOL/MIS QFN-dr/mr2L WB laminate/ 1L(Single Metal SueWLB 1L RDLQFNQFP1L WB - MIS1/2L FC - MISMIS can be used for leaded/laminate wirebond& flip chip Packaging eWLB drives superior performance and integrationFlip chipWirebondSingle Metal SubstrateFlip Chip on LeadFrameMolded Interconnect Substrate/systemEmbedded Wafer Level Ball Grid ArrayMIS (Molded Interconnect System/Substrate)Carrier4Pre-mold compoundFinish plating: NiPdAu, NiAu, Cu+OSPSurface finish(Cu+OSP / NiAu/ NiPdAu) 1LMIS substrate 4B 250x70mm ( thickness)Cross section viewRoutableExternal leadTrace 1L MIS Process FlowORMIS Design & Application1LMIS (PM Application)Package thickness: pitch: pitch: structure: Cu pillar bump with tin c)

dvanced Packaging Technologies for Miniaturized Modules Vinayak Pandey VP, Product Technology Marketing, STATS ChipPAC

  Packaging, Technologies, Module, Dvanced packaging technologies for miniaturized modules, Dvanced, Miniaturized