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Semiconductor Packaging Assembly TechnologyIntroductionThis chapter describes the fundamentals of the processesused by National Semiconductor to assemble IC devices inelectronic packages. Electronic Packaging provides the in-terconnection from the IC to the printed circuit board (PCB).Another function is to provide the desired mechanical andenvironmental protection to ensure reliability and perfor-mance. Three fundamental Assembly flow processes (Table1) are covered in this chapter: 1) plastic leadframe-basedpackages, 2) plastic ball grid array (PBGA), and 3) 1. Assembly Flow Processes for ElectronicPackagesPlastic(Leadframe)Plas tic (BGA)HermeticWafer SortWafer SortWafer Sort2nd Optical2nd Optical2ndOpticalWafer MountWafer MountWaferMountWafer SawingWafer SawingWaferSawingDie AttachDie AttachDie AttachWire BondWire BondWire Bond3rd Optical3rd Optical3rdOpticalEncapsulate(Mold Compound)Encapsulate (MoldCompound or GlobTop)Lid SealDejunkBall Attach andReflowLeakageTestDeflashSingulateMark ingBall InspectionPlatingMarkingTrim and FormFinal InspectionThe fundamental package Assembly pr

Semiconductor Packaging Assembly Technology Introduction This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC …

  Technology, Packaging, Assembly, Semiconductors, Semiconductor packaging assembly technology