SPECIFICATION GUIDELINES - DDM Consulting

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SPECIFICATIONGUIDELINESFORHOT AIRSOLDER LEVELINGREV 5A8 Delta DriveLondonderry, NH 03053 USAPhone:(603) 434-4156Fax:(603) Issue Date: 06/04 define solder leveling capabilities and meaningful solder thickness measurement document will establish achievable solder thickness requirements that can be used forspecifying and standardizing solder thickness on printed wiring boards (PWBs). This document isintended to provide a common set of terms, definitions and measurement techniques for PWBmanufacturing and End User or OEM customer.

4 3.6 DISTRIBUTION: Levelness within ONE PAD. • To determine the range of solder thickness over a feature (PAD). A minimum of five (5) …

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