Transcription of SPECIFICATION GUIDELINES - DDM Consulting
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SPECIFICATION GUIDELINES - DDM Consulting
SPECIFICATIONGUIDELINESFORHOT AIRSOLDER LEVELINGREV 5A8 Delta DriveLondonderry, NH 03053 USAP hone:(603) 434-4156 Fax:(603) Issue Date: 06/04 define solder leveling capabilities and meaningful solder thickness measurement document will establish achievable solder thickness requirements that can be used forspecifying and standardizing solder thickness on printed wiring boards (PWBs). This document isintended to provide a common set of terms, definitions and measurement techniques for PWBmanufacturing and End User or OEM customer.
4 3.6 DISTRIBUTION: Levelness within ONE PAD. • To determine the range of solder thickness over a feature (PAD). A minimum of five (5) …
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