Technical Data Sheet ABLEFILM 5025E™

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TechnicalDataSheet ABLEFILM 5025E May-2009 PRODUCTDESCRIPTIONABLEFILM 5025E provides thefollowingproductcharacteristics:Techn ologyEpoxyFilmAppearanceSilverCureHeatcu reProduct Benefits Thin,uniformbondline ProvidesRF/EMIshielding Electricallyconductivein x, y, z axes Excellentelectricalandthermalconductivit yApplicationDieattachThickness2 to6 milsFillerTypeSilverTypicalPackageApplic ationMicrowavecircuitry 5025E unsupportedepoxyadhesivefilmis idealforbonding"hot"devicesontoheatsinks in applicationswhereelectricalinsulationis @25 C, months3ShelfLife@5 C(fromdateof manufacture), months6TYPICALCURINGPERFORMANCECureSched ule30 minutes@150 C AlternativeCureSchedule2 hours@125 C WeightLossonCure10x 10mmSidieonglassslide,% (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment, :Coefficientof ThermalExpansion:BelowTg,ppm/ C65AboveTg,ppm/ C150GlassTransitionTemperature (Tg) by TMA, C90ThermalConductivity@121 C, , DMTA:@-65 C N/mm 5,400 (psi) (790,000)@25 C N/mm 3,700 (psi) (530,000)@150 C N/mm 49 (psi) (7,100)@250 C N/mm 28 (psi) (4,000)ExtractableIonicContent,@100 C ppm:Chloride(Cl-)50Sodium(Na+)30Potassiu m(K+)5WaterExtractConductivity, @85 C/85 :VolumeResistivity,ohms-cm , sqinch< :2 X 2 mmSidie, kg-f,Substrate@25 CAg/Culeadframe13 Lap ShearStrength,ps

• Electrically conductive in x, y, z axes • Excellent electrical and thermal conductivity Application Die attach Thickness 2 to 6 mils Filler Type Silver Typical Package Application Microwave circuitry and Heat sink attach pH 6.0 ABLEFILM® 5025E™ unsupported epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in ...

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