AN-1520 A Guide to Board Layout for Best Thermal ...
1SNVA183B September2006 RevisedApril2013SubmitDocumentationFeedb ackCopyright 2006 2013,TexasInstrumentsIncorporatedAN-1520 A Guideto BoardLayoutfor BestThermalResistancefor ExposedPackagesAll trademarksare the propertyof September2006 RevisedApril2013AN-1520A Guideto BoardLayoutfor BestThermalResistancefor ExposedPackagesABSTRACTThis thermalapplicationreportprovidesguidelin esfor the optimalboardlayoutto achievethe best thermalresistancefor ( JA) is highlydependenton the PCB(PrintedCircuitBoard) packageshavingverylow thermalresistancebetweenjunction-to-case ,suchas exposedpad TSSOP(e-TSSOP),exposedpad QFP(e-QFP),and casestudyof the LM2652in a 28-leade-TSSOPpackagedemonstratesthe PCBdesignimpacton JA,and generatesdesignrecommendationsto improvethe variouslayoutsof groundplanesbasedon a 3 x3 size and newPCBsreduced JAfromthe rangeof 40 50 C/Wdownto 25 30 (FEA)modelingwas usedfor sensitivityanalysisto identifythe key PCB(PrintedCircuitBoard) of Figures1CrossSectionViewof ' Viewof 28L (a) The ImageOf IR Camerafor the TemperatureDistributionNearPackageand (b) the TemperaturePlot Alongthe (a), (b) And (c) for the ThreeTypesof PCBB
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