Changing Wafer Size and the Move to 300mm

Source: ICE 20191 Dice Per Wafer Die Size (mm2) 10,000 1,000 100 10 1 0 200 400 600 800 1,000 1,200 1,400 300 mm 200 mm 150 mm 125 mm 100 mm Figure 7-4. Dice Per Wafer Based on Die Size and Wafer Size. Changing Wafer Size and the Move to 300mm INTEGRATED CIRCUITENGINEERING CORPORATION 7-5 DIE AREA mil x1,000 2 mm2 3-INCH 100mm …

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