Transcription of Changing Wafer Size and the Move to 300mm
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Changing Wafer Size and the Move to 300mm
77 Changing Wafer size and the move to 300mmAs discussed in Chapter 1, the industry sability to increase productivity by 25-30 per-cent per year is the combined result of wafersize transitions, shrinking device geometries,equipment productivity improvements, andincremental yield improvements. Wafer sizetransitions historically account for 4 percentof the 25-30 percent productivity make Wafer size transitionsbecause of the overall cost benefits resultingfrom the larger number of dice per Wafer ,thereby using the same number of processsteps to produce more dice.
Source: ICE 20191 Dice Per Wafer Die Size (mm2) 10,000 1,000 100 10 1 0 200 400 600 800 1,000 1,200 1,400 300 mm 200 mm 150 mm 125 mm 100 mm Figure 7-4. Dice Per Wafer Based on Die Size and Wafer Size. Changing Wafer Size and the Move to 300mm INTEGRATED CIRCUITENGINEERING CORPORATION 7-5 DIE AREA mil x1,000 2 mm2 3-INCH 100mm …
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