Transcription of 27C256
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27C256
27C256 . 256K (32K x 8) CMOS EPROM. FEATURES PACKAGE TYPES. TSOP. High speed performance OE 1 28 A10. - 90 ns access time available A11 2 27 CE. CMOS Technology for low power consumption A9 3 26 D7. A8 4 25 D6. - 20 mA Active current A13 5 24 D5. A14 6 23. - 100 A Standby current D4. 27C256 . VCC 7 22 D3. Factory programming available VPP 21. 8 VSS. Auto-insertion-compatible plastic packages A12 9 20 D2. A7 10 19 D1. Auto ID aids automated programming A6 11 18 D0. A5 12 17 A0. Separate chip enable and output enable controls A4 13 16 A1. High speed express programming algorithm A3 14 15 A2. Organized 32K x 8: JEDEC standard pinouts PLCC. A12. A14. A13. Vcc VPP. NU. A7. - 28-pin Dual-in-line package 4. 3. 2. 1. 32. 31. 30. - 32-pin PLCC Package A6 5 29 A8. - 28-pin SOIC package A5 6 28 A9. A4 7 27 A11. - 28-pin Thin Small Outline Package (TSOP). 27C256 .
27C256 DS11001L-page 6 1996 Microchip Technology Inc. 1.3 Standby Mode The standby mode is defined when the CE pin is high (VIH) and a program mode is not defined.
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