Transcription of 56-Pin Quad Flatpack No-Lead Logic Package
{{id}} {{{paragraph}}}
Example: marketing
56-Pin Quad Flatpack No-Lead Logic Package
Application ReportSCEA032 - March 2003156-Pin quad Flatpack No-Lead Logic PackageFrank Mortan and Lance WrightSLL Package DevelopmentABSTRACTT exas Instruments (TI) quad Flatpack No-Lead (QFN) 56-terminal Package complies withJEDEC standard MO-220, allows for board miniaturization, and holds several advantagesover traditional SOIC, TQFP, TSSOP, and TVSOP packaging. This Package , designatedRGQ by TI, physically is smaller than traditional leaded solutions, has a smaller routing area,improved thermal performance, and improved electrical parasitics. Additionally, the absenceof external leads eliminates bent-lead concerns and issues. This QFN Package is packed toindustry-standard tape-and-reel specifications. Package marking is in accordance with .. 2 Industry Requirements3.. 3 Physical Description3.
SCEA032 56-Pin Quad Flatpack No-Lead Logic Package 3 2 Industry Requirements The consumer-electronics industry is focused on …
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: