Transcription of Quad Flatpack No-Lead Logic Packages (Rev. D) - …
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Quad Flatpack No-Lead Logic Packages (Rev. D) - …
Application Report SCBA017D February 2004. quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT. Texas Instruments (TI) quad Flatpack No-Lead (QFN) 14/16/20-terminal Pb-free plastic Packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP Packages . The Packages are physically smaller, have a smaller routing area, improved thermal performance, and improved electrical parasitics, while giving customers a pinout scheme that is consistent with the previously mentioned Packages . Additionally, the absence of external leads eliminates bent-lead concerns and issues. These QFN Packages have reliable solderability with either SnPb or Pb-free solder paste and are packaged to industry-standard tape-and-reel specifications.
SCBA017D Quad Flatpack No-Lead Logic Packages 9 Figures 5 through 7 compare the QFN package size, height, and weight to that of alternative package solutions.
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