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Accelerated Thermal Cycling and Failure Mechanisms For …
Accelerated Thermal Cycling and Failure Mechanisms For BGA and CSP Assemblies Reza Ghaffarian, Jet Propulsion Laboratory California Institute of Technology Pasadena, California 818-354-2059 ABSTRACT This paper reviews the Accelerated Thermal Cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies. Acceleration induced Failure Mechanisms varied from conventional surface mount (SM) failures for CSPs.
for processes, tailored testing methods for qualification, and use of unique accelerated environmental testing along with credible analytical prediction. In other words, an efficient ... absorbed CSP— a fatigue failure shift from the solder joint to the internal package (see Figure 1).
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