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Accelerating Innovation Through a Standard Chiplet Interface

White paper Heterogeneous Integration Accelerating Innovation Through A Standard Chiplet Interface : The Advanced Interface Bus (AIB). Authors Introduction David Kehlet The semiconductor industry has been on a decades-long quest to place as much Research Scientist functionality as possible on a single die. For most of that time, a monolithic Intel Programmable Solutions Group implementation has provided the best combination of performance, power, and capability, as compared to connecting two chips together using the packaging and interconnect technologies available at the time. Figure 1. An example of AIB application, where the analog front-end, signal Table of Contents pre-processing, and SERDES are connected, all by AIB, to an FPGA. implementing classification and object tracking. Introduction .. 1. The AIB Objective.

called chiplets or tiles – the challenge is to interconnect them all in a single package while keeping performance and power close to what would be possible if they were all monolithic. ... Network Data Link Physical (PHY) Figure 2. AIB is a physical-layer specification.

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