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ASSOCIATION CONNECTING ELECTRONICS …

IPC-HDBK-005 guide to SolderPaste AssessmentDeveloped by the solder Paste Task Group (5-24b) of the Assemblyand Joining Processes Committee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 CONNECTINGELECTRONICS INDUSTRIES Table of .. and Definitions .. solder Paste .. 12 APPLICABLE .. Industry Standards .. Electrotechnical CommissionDocuments .. of Wetting .. of Wetting .. Measurement .. Affecting Solderability DuringReflow Soldering Process .. Surface Finish .. Air solder Leveling (HASL) .. Coating .. Solderability Preservatives (OSP).. Lead Composition/Finish .. Metal .. Composition.

IPC-HDBK-005 Guide to Solder Paste Assessment Developed by the Solder Paste Task Group (5-24b) of the Assembly and Joining Processes Committee (5-20) of IPC

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