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Bonding Technologies for the Next Generation Integration ...

Technologies for the Next Generation Integration SchemesJ rgen BURGGRAF Process Technology Manager, Wafer Bonding Group Confidential and Proprietary presented at IEEE - Electronics Packaging 2021 ConfidentialOutline Introduction EVG at a Glance Recent Developments Product Portfolio & Competence Bonding Technology for the Next Generation Integration Schemes Introduction Bonding Requirements to meet trends Fusion & Hybrid Bonding ComBond Wafer level vs. Die to Wafer Integration Overview Process Results Summary & Outlook Group Confidential and Proprietary presented at IEEE - Electronics Packaging 2021 ConfidentialEV Group | At A GlanceLeading supplier of wafer processing equipment for the MEMS, nanotechnology and semiconductor marketsFounded in 1980 by DI Erich and Aya Maria Thallner.

EV Group Confidential and Proprietary presented at IEEE - Electronics Packaging 2021 Confidential www.EVGroup.com EV Group | At A Glance Leading supplier of wafer processing equipment for the MEMS, nanotechnology and semiconductor markets Founded in 1980 by DI Erich and Aya Maria Thallner. More than 1000 employees worldwide

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