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Chapter 23: Wafer Level Packaging

2019 Edition Chapter 23: Wafer Level Packaging We acknowledge with gratitude the use of material and figures in this Roadmap that are excerpted from original sources. Figures & tables should be re-used only with the permission of the original source. The HIR is devised and intended for technology assessment only and is without regard to any commercial considerations pertaining to individual products or equipment. October, 2019 Table of Contents HIR Version ( ) Page ii Heterogeneous Integration Roadmap Table of Contents Chapter 1: HETEROGENEOUS INTEGRATION ROADMAP: OVERVIEW .. 1 Chapter 2: HIGH PERFORMANCE COMPUTING AND DATA CENTERS.

The first eWLB in volume production was a single-die package, combining baseband with PMIC and RF features. The die were about 5x5mm in 8x8mm fan out packages that varied between 183 and 217 solderballs. An example is shown in figure 7. …

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