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Chapter 23: Wafer Level Packaging - IEEE

2019 Edition Chapter 23: Wafer Level Packaging We acknowledge with gratitude the use of material and figures in this Roadmap that are excerpted from original sources. Figures & tables should be re-used only with the permission of the original source. The HIR is devised and intended for technology assessment only and is without regard to any commercial considerations pertaining to individual products or equipment. October, 2019 Table of Contents HIR Version ( ) Page ii Heterogeneous Integration Roadmap Table of Contents Chapter 1: HETEROGENEOUS INTEGRATION ROADMAP: OVERVIEW.

The intent of this chapter is to provide a brief overview of Wafer Level Packaging (WLP), including Wafer Level Chip Scale Packaging (WLCSP) and Fan Out packaging, as a background for a …

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Chapter 23: Wafer-Level Packaging (WLP) - IEEE

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