Transcription of Design Summary Multi-rowQuad Flat No …
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ApplicationReportSZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)..ABSTRACTT exasInstrumentsIncorporated(TI)introduce stheMulti-rowQuadFlatNo-lead(MRQFN) ,withoutperipherallyprotrudingleads, , :100 Pin(MRQFN)PackageMRQFNP ackageDetails(1)100 Pin(MRQFN)TotalNumberofPins100 Package*Length(L)mm9 Package*Width(W)mm9 PackageThickness(T) , (JEDEC)MSL3 / 260C(1)NominalDimensionsShown(SeePackage Drawingforfullinformation)1 SZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporatedPCB LAND PAD DETAIL A Note: The PCB land pattern illustrated is specificallydesigned by part number therefore, variations inthermal pad dimensions may exist betweenpart numbers.
1.73 1.73 1.58 1.58 1.58 1.58 16x0.20 www.ti.com PCB Land Pad / Stencil Design Notes (A) All dimensions are in millimeters. (B) These drawings are subject to …
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Choosing a Stencil, Considerations, Stencil design, Stencil, PRINTING AND ASSEMBLY CHALLENGES FOR QUAD FLAT, A Design and Manufacturing Guide for, Design, Reflow Soldering Process Considerations for, Reflow Soldering Process Considerations for Surface, Design and Assembly Process Implementation for, Ball Grid Array Package Reference Guide, SMT Process Guideline and Checklist