Transcription of Design Summary Multi-rowQuad Flat No …
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ApplicationReportSZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)..ABSTRACTT exasInstrumentsIncorporated(TI)introduce stheMulti-rowQuadFlatNo-lead(MRQFN) ,withoutperipherallyprotrudingleads, , :100 Pin(MRQFN)PackageMRQFNP ackageDetails(1)100 Pin(MRQFN)TotalNumberofPins100 Package*Length(L)mm9 Package*Width(W)mm9 PackageThickness(T) , (JEDEC)MSL3 / 260C(1)NominalDimensionsShown(SeePackage Drawingforfullinformation)1 SZZA059 August2012 DesignSummaryMulti-rowQuadFlatNo-lead(MR QFN)SubmitDocumentationFeedbackCopyright 2012,TexasInstrumentsIncorporatedPCB LAND PAD DETAIL A Note: The PCB land pattern illustrated is specificallydesigned by part number therefore, variations inthermal pad dimensions may exist betweenpart numbers. The exposed pad sizes can beconfirmed within the product data , contact your TI customerrepresentative for further ,05 TYP0,050,400,600,250,05 TYP0,05 TYP0,05 TYP0,05 TYP0,05 TYPEXAMPLE NON-SOLDERMASK OPENING (NOTE F)0,30 ,25 TYP0,600,407,308,807,308,800,25 TYP0,600,400,600,550,550,60 SEE NOTE8,508,500,30 SQDETAIL "A" (NonSolderMaskDefined)padsoverSMD(Solder MaskDef)
1.73 1.73 1.58 1.58 1.58 1.58 16x0.20 www.ti.com PCB Land Pad / Stencil Design Notes (A) All dimensions are in millimeters. (B) …
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Surface Mount - Mounting Pad Dimensions and, Surface Mount - Mounting Pad Dimensions and Considerations, Meter mounting & distribution equipment, Reflow Soldering Process Considerations for, Reflow Soldering Process Considerations for Surface Mount, Surface Mount Ultrafast Plastic Rectifier, Surface Mount