Transcription of DuPont Pyralux AP
{{id}} {{{paragraph}}}
DuPont Pyralux AP. flexible circuit materials Technical Data Sheet Description Table 1. DuPont Pyralux AP flexible circuit material is a DuPont Pyralux AP. double-sided, copper-clad laminate and an all- Product Offerings*. polyimide composite of polyimide film bonded to Dielectric Copper copper foil. This material system is ideal for multilayer Thickness Thickness Product Code flex and rigid flex applications which require advanced mil m (oz/ft2). material performance , temperature resistance, and high reliability. AP 7163E** 9 (.25). AP 7164E** 12 (.)
Product Highlights and Applications A Thin High-Performance Sheet Clad Laminate for High Density Flex Circuits 1 mil DuPont™ Pyralux® AP flexible circuit materials
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}
High, Copper wire bonding, Products, NexFETTM High Performance MOSFETs, HIGH PERFORMANCE, QUALITY, RELIABILITY, RANGE AND, Copper, Quality, reliability, range and performance, Products Copper, TerminaTion cap High, Termination Cap, Resistive Hydraulic Oils Without Sacrificing Performance, Reactivity protective equipment nfpa rating