Transcription of Dye and Pry of BGA Solder Joints - Cascade Engineering
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Dye and Pry of BGA Solder Joints - Cascade Engineering
Dye and Pry of BGA Solder Engineering GroupCascade Engineering Services, 185th Ave NE Redmond WA 98052(425) 895-8617 x 564 CPU Failure InvestigationEquipment Used Dye and Pry TechniqueConclusions Majority of failures (cracks from mechanical bend overstress test) observed at Solder -Chip interface Summary of % area cracked at each interface in the area of interestOptical Image with Extended Focal Imaging StitchingSol der- Chi pOkSol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- Chi p~5%Sol der- Chi pOkSol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- Chi p~10%Sol der- PCBOkSol der- PCBOkSol der- PCBOkSol der- Chi p~20%Sol der- PCBOkChipPCBDRAM Failure InvestigationEquipment Used Dye and Pry TechniqueConclusions Interfacial fracture / cracks observed at two locations.
Dye and Pry of BGA Solder Joints www.cascade-eng.com Reliability Engineering Group Cascade Engineering Services, Inc. 6640 185th Ave NE Redmond WA 98052
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