Transcription of FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
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AEC - Q102 - Rev A April 6, 2020 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR OPTOELECTRONIC SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS Component Technical CommitteeAutomotive Electronics Council AEC - Q102 - Rev A April 6, 2020 Component Technical CommitteeAutomotive Electronics CouncilTABLE OF CONTENTS AEC-Q102 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Optoelectronic Semiconductors in Automotive Applications Appendix 1: Definition of a QUALIFICATION Family Appendix 2: AEC-Q102 Certification of Design, Construction and QUALIFICATION Appendix 3: AEC-Q102 QUALIFICATION Test Plan Appendix 4: Data Presentation Format Appendix 5: Minimum Parametric Test Requirements and FAILURE Criteria Appendix 6: Destructive Physical Analysis (DPA) Appendix 7: AEC-Q102 and the Use of Mission Profiles Appendix 7a: Reliability Validation for Optoelectronic Semiconductors Attachments
This document defines the minimum stress test driven qualification requirements and references test conditions for qualification of optoelectronic semiconductors (e.g., light emitting diodes, photodiodes, laser components (see Figure 1a & b)) in all exterior and interior automotive applications. It combines
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