Transcription of FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION …
AEC - Q101 - Rev - E March 1, 2021 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR DISCRETE SEMICONDUCTORS IN AUTOMOTIVE APPLICATIONS Component Technical CommitteeAutomotive Electronics Council AEC - Q101 - Rev - E March 1, 2021 Component Technical CommitteeAutomotive Electronics CouncilTABLE OF CONTENTS AEC-Q101 FAILURE MECHANISM BASED STRESS Test QUALIFICATION for Discrete Semiconductors in Automotive Applications Appendix 1: Definition of a QUALIFICATION Family Appendix 2: Q101 Certification of Design, Construction and QUALIFICATION Appendix 3: QUALIFICATION Plan Appendix 4: Data Presentation Format Appendix 5: Minimum Parametric Test Requirements Appendix 6: Plastic Package Opening for Wire Bond Testing and Inspection Appendix 7: AEC-Q101 and the Use of Mission Profiles Attachments AEC-Q101-001: Electrostatic Discharge Test - Human Body Model AEC-Q101-002: Electrostatic Discharge Test - Machine Model (DECOMMISSIONED) AEC-Q101-003: Wire Bond Shear T
IATF 16949 1.2.5 Decommissioned AEC-Q101-002 Machine Model (MM) Electrostatic Discharge (ESD) Test • Removed from JEDEC due to obsolescence. HBM and CDM cover virtually all known ESD-related failure mechanisms. 1.3 Definitions 1.3.1 AEC Q101 Qualification
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