Transcription of Fan-Out Wafer Level Package（FO-WLP）用 UVレーザー剥 …
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Fan-Out Wafer Level Package（FO-WLP）用 UVレーザー剥 …
Fan-Out Wafer Level Package FO-WLP . UV . UV Laser Releasable Temporary Bonding Materials for Fan-Out Wafer Level Package (FO-WLP). 1 2 3 4. Kenzo Ohkita Hikaru Mizuno Hiroyuki Ishii Hitoshi Kato 5 6 7 8. Takashi Mori Hiroki Ishikawa Yooichiroh Maruyama Koichi Hasegawa Temporary bonding/de-bonding (TBDB) technology in a FO-WLP process is required to adapt to a low tempera- ture process because of the potential for damage in handling the thin molded compound embedding dies. We have developed laser releasable TBDB materials for low temperature bonding processes that enable UV laser release with high throughput and low thermal/mechanical stress. The developed TBDB materials consist of two layers, an adhesive layer and a release layer.
近ではFan-Out Wafer Level Package（FO-WLP）や，貫 通シリコンビア（TSV）による2.5Dインターポーザーや3D パッケージなどの先端実装デバイス類が開発されてきた1）． FO-WLPとは，小型化した半導体チップの面を超えて
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