Transcription of Fully Automatic In-Feed Surface Grinder DFG8540/8560
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Fully Automatic In-Feed Surface Grinder DFG8540/8560
DFG8540/8560 Fully Automatic In-Feed Surface GrinderAdvanced thinning power for large wafersGrinderofchoiceTheDFG8540 (<100 m) 'sDicingBeforeGrinding(DBG)systemaswella spolishers(DFP8140/8160) grinding qualityThrough innovations in equipment design, both spindles now grind wafers at the same relative position. This improves single wafer thickness variation as well as wafer to wafer thickness the same proven technology of DISCO s 800-series grinding wheels, spindles, chuck tables and dresser panelLCD touch screenDFG8560 Easy operationThe DFG8540/8560 utilizes an LCD touch screen graphicaluser interface, making operation and maintenance intuitive Automatic In-Feed Surface GrinderDFG8540/8560 SpecificationsSafe wafer handling with the thin wafer robot pickEnvironmental conditions Use clean, oil-free air at a dew point of -15 Cor less.
DFG8540/8560 Fully Automatic In-Feed Surface Grinder Advanced thinning power for large wafers Grinder of choice The DFG8540/8560 improves upon the functionality and performance
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