Transcription of High-End Performance Packaging: 3D/2.5D Integration 2020
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High-End Performance Packaging: 3D/2.5D Integration 2020
From Technologies to Markets 2020 High-End Performance packaging : 3 Integration 2020 Market and Technology ReportSample2 Tableofcontents2 Scopeofreport4 Reportmethodologies&definitions6 Keyfeaturesofthisreport5 Abouttheauthor7 YoleGroupofcompaniesrelatedreports9 Glossaries11 Companiescitedinthisreport12 3-Pagesummary13 Executivesummary17 Context66oSemiconductorindustry playerspursuingMoore slaw67oHigh-endperformancepackagingdefin ition71oScopeofreport72oHigh-endperforma ncepackagingmarketsegment73oHigh-endperf ormancepackagingintroduction74 Marketforecasts75oMarketRevenue76oTotalm arketrevenueoSplitbyend-marketoSplitbyte chnologyoMarketUnits80oTotalmarketunitso Splitbyend-marketoSplitbytechnologyHigh- end Performance packaging : 3 Integration 2020 | Sample | | 2020 TABLE OF CONTENTSPart 1 Markettrends96oCloud&edgecomputing97oClo udcomputingandnetworking103oHigh-Perform anceComputing(HPC)111oArtificialintellig enceforautonomousvehicles119oChapterconc lusion125 Commercializedproductsanditssupplychain1 27oProductlaunches130o3 Dstackedmemorieso(x)PUoGPUforHPCoSupplyc hainforhigh-endperformancepackaging156oG lobalmappingofhigh-endpackagingoGlobalma ppingbasedontechnologyoSupplychainforhig h-endpackagingproductsoLatestprogressofk eyplayers1753oSupplychainanalysisinhigh- endperformancepackaging188oPackaging su
o Semiconductor packaging roadmap o Advanced packaging roadmap o High-end packaging roadmap: iO pitch vs IOdensity o High-end packaging roadmap: application-technology o Key player’stechnology roadmap 221 o Short description of chiplet 227 o 3D SoC 230 o Hybrid bonding 234
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