Transcription of High-End Performance Packaging: 3D/2.5D Integration 2020
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High-End Performance Packaging: 3D/2.5D Integration 2020
From Technologies to Markets 2020 High-End Performance packaging : 3 Integration 2020 Market and Technology ReportSample2 Tableofcontents2 Scopeofreport4 Reportmethodologies&definitions6 Keyfeaturesofthisreport5 Abouttheauthor7 YoleGroupofcompaniesrelatedreports9 Glossaries11 Companiescitedinthisreport12 3-Pagesummary13 Executivesummary17 Context66oSemiconductorindustry playerspursuingMoore slaw67oHigh-endperformancepackagingdefin ition71oScopeofreport72oHigh-endperforma ncepackagingmarketsegment73oHigh-endperf ormancepackagingintroduction74 Marketforecasts75oMarketRevenue76oTotalm arketrevenueoSplitbyend-marketoSplitbyte chnologyoMarketUnits80oTotalmarketunitso Splitbyend-marketoSplitbytechnologyHigh- end Performance packaging : 3 Integration 2020 | Sample | | 2020 TABLE OF CONTENTSPart 1 Markettrends96oCloud&edgecomputing97oClo udcomputingandnetworking103oHigh-Perform anceComputing(HPC)111oArtificialintellig enceforautonomousvehicles119oChapterconc lusion125 Commercializedproductsanditssupplychain1 27oProductlaunches130o3 Dstackedmemorieso(x)PUoGPUforHPCoSupplyc hainforhigh-endperformancepackaging156oG lobalmappingofhigh-endpackagingoGlobalma ppingbasedontechnologyoSupplychainforhig h-endpackagingproductsoLatestprogressofk
definition for high–end performance packaging within semiconductor industry. If distinct advanced packaging technologies, including flip-chip, embedded die, 2.5D Si interposers, 3D-IC, fan-in, fan-out and hybrid bonding, are considered as high-end performance packaging, then this will be over generalizing high–end performance packaging.
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