Transcription of High Speed USB Platform Design Guidelines - USB.org
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High Speed USB Platform DesignGuidelinesRev. Speed USB Platform Design GuidelinesPage 24/26/01 REVISION HISTORYR evisionRevision "THIS SPECIFICATION [DOCUMENT] IS PROVIDED "AS IS" WITH NO WARRANTIESWHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY,NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTYOTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. Inteldisclaims all liability, including liability for infringement of any proprietary rights, relating to use ofinformation in this specification.
High Speed USB Platform Design Guidelines Page 5 4/26/01 most motherboards. The short route was chosen for comparison of routing lengths and via counts as well
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Considerations for PCB Layout and Impedance, SMSC Ethernet Physical Layer Layout, SMSC Ethernet Physical Layer Layout Guidelines, Design Considerations in Mixed, Design Considerations in Mixed Signal System, TPD12S016 PCB Layout Guidelines for, Ultralow Noise VGAs with Preamplifier and, Ultralow Noise VGAs with Preamplifier and Programmable, Analog Devices, Protection Data Sheet ADM2682E/ADM2687E, Power MOSFET