Transcription of Introduction to Probe Cards - SWTest.org
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Introduction to Probe Cards - SWTest.org
Integrated Technology CorporationCopyright 1998 IntroductiontoProbe CardsHow They are Built & Tested Integrated Technology CorporationCopyright 1998 Probe Cards & PROCESSCOURTESY OFCERPROBEI ntegrated Technology CorporationCopyright 1998 Design & LayoutIntegrated Technology CorporationCopyright 1998 DIE PAD CONFIGURATIONS 500 mils on each sideThese configurations typically use standard rings(1a)(1b)XYDM ulti-DU(1d)> 500 mils on any side(1c)These configurations typically requisemicustom or custom ringsFigure 1: Die and Ring Configuration ExamplesIntegrated Technology CorporationCopyright 1998 BONDING PADSABCBond PadMetalizationPassivationOpening(Bond Pad Size)Figure 2: Bond Pad Pitch and SizeIntegrated Technology CorporationCopyright 1998 CROSS SECTION, CANTALEVER BEAME poxyRing ApertureProbe Tip DepthPCB ApertureRingProbePCBPCB ottoSurfaProbe DetailsProbe WireDiameterTipLengthTip D
Michael George (408) 727-6500 x6244 ©Copyright 1998 Wafer Alignment (2) Automatic Alignment. Title: T1_Hank.PDF Created Date: Saturday, September 12, 1998 3:50:14 AM
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