Transcription of MEMS Solution for Semiconductor Probing - …
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mems Solution for Semiconductor ProbingMEMS Solution for Semiconductor ProbingSouthSouth--Western Testing Workshop PresentationWestern Testing Workshop Presentation SCS Hightech by Dr. Howard Hsu06-06-200522 Presentation OverviewMEMS Probing Technology Roadmap- Compliant Probing Structure- Tighter Control of Electrical ConnectionIntroduction- Device Geometry vs. IC Characteristics- Device Geometry vs. Pad Layout Rule and Package Technology- Classical Probing Technology is Insufficient at These Circumstances- Mechanical Probing Has Shown Productivity Degradation in Volume Production- mems VPC SolutionProbing Mechanism Comparison Classical vs. mems - Structural Differences- Material Combination & Technology Development- Mechanism Practices- Performance ComparisonDevelopment Challenges & solutions for mems Probing - Test, Assembly, and Operation - Reliability - IC Concerns mems Solution for Semiconductor ProbingMEMS Solution for Semiconductor ProbingIntroductionIntroduction44 IntroductionDevice Geometry vs.
MEMS Solution for Semiconductor Probing South-Western Testing Workshop Presentation 矽晶源高科股份有限公司 SCS Hightech Inc. Presented by Dr. Howard Hsu
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History and Future of Hitachi's Plasma Etching, History and Future of Hitachi’s Plasma Etching System, Plasma, Chapter 6 ELECTRON TRANSPORT, Function, Lorentz, Plasma Etching System and its Applications, Plasma Etching System and its Applications to 45–32-nm Leading, MEMs Variable Capacitors for Tunable Filters