Transcription of MEMS Solution for Semiconductor Probing - SWTest.org
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mems Solution for Semiconductor ProbingMEMS Solution for Semiconductor ProbingSouthSouth--Western Testing Workshop PresentationWestern Testing Workshop Presentation SCS Hightech by Dr. Howard Hsu06-06-200522 Presentation OverviewMEMS Probing Technology Roadmap- Compliant Probing Structure- Tighter Control of Electrical ConnectionIntroduction- Device Geometry vs. IC Characteristics- Device Geometry vs. Pad Layout Rule and Package Technology- Classical Probing Technology is Insufficient at These Circumstances- Mechanical Probing Has Shown Productivity Degradation in Volume Production- mems VPC SolutionProbing Mechanism Comparison Classical vs. mems - Structural Differences- Material Combination & Technology Development- Mechanism Practices- Performance ComparisonDevelopment Challenges & solutions for mems Probing - Test, Assembly, and Operation - Reliability - IC Concerns mems Solution for Semiconductor ProbingMEMS Solution for Semiconductor ProbingIntroductionIntroduction44 IntroductionDevice Geometry vs.
MEMS Solution for Semiconductor Probing South-Western Testing Workshop Presentation 矽晶源高科股份有限公司 SCS Hightech Inc. Presented by Dr. Howard Hsu
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Design for Reliability: Overview of the Process, Management and Organization, Management and Organization Reliability, Dimension Measurement System for Semiconductor Processes, Reliability, Setting Maintenance Priorities through a, The Business Case for Lean Six, Soft Skills are Smart Skills, Course17:Process Improvement